US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,225, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Heejae Nam (Suwon-si, South Korea), Junyun Kweon (Suwon-si, South Korea), Wooju Kim (Suwon-si, South Korea) and Junggeun Shin (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a package substrate having an upper surface and a lower surface opposite to the upper surface, the package substrate having first substrate pads along a side portion thereof and second substrate pads outside the first substrate pads, be...