US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,231, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the same" was invented by Yuseon Heo (Suwon-si, South Korea), Jihye Shim (Suwon-si, South Korea) and Junhyeong Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a method of manufacturing a semiconductor package, the method including forming a first wiring structure, forming a multi-layer photoresist on the first wiring structure, forming a plurality of openings in the multi-layer photoresist by exposing and developing the multi-layer photoresist, forming a plurality of c...