US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and method for fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,234, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method for fabricating the same" was invented by Young Kun Jee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to semiconductor packages. An example semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a first bonding pad disposed on a first surface of the first semiconductor chip facing the second semiconductor chip, and a second bonding pad disposed on a second surface of the second semiconductor chip facing t...