US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,190, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Seok Geun Ahn (Suwon-si, South Korea), Seokhyun Lee (Suwon-si, South Korea), Yanggyoo Jung (Suwon-si, South Korea) and Hwanyoung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an interposer substrate on the package substrate, first connection bumps between the package substrate and the interposer substrate, first and second semiconductor chips on the interposer substrate, second connection bumps between the interposer substrate and the f...