ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,769, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Kyungdon Mun (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package may include a base wiring structure, a first bridge chip and a cache memory chip on the base wiring structure and spaced apart from each other in a horizontal direction, and logic semiconductor chips adjacent to each other on the first bridge chip and the cache memory chip. Logic semiconductor chips each may include a cache memory. The first bridge chip may overlap at least two of the logic semiconductor chips in...