US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor devices including conductive filling pattern" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,728, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor devices including conductive filling pattern" was invented by Jingyu Park (Suwon-si, South Korea), Jongyoung Park (Suwon-si, South Korea), Taeyoung Koh (Suwon-si, South Korea), Kiyong Kim (Suwon-si, South Korea), Sundoo Kim (Suwon-si, South Korea) and Jaehyun Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first active pattern on a substrate, the first active pattern extending in a third direction having an acute angle with respect to a first direction and a second direction, the fir...