US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor device including bit line pad, method for manufacturing the same and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,742, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including bit line pad, method for manufacturing the same and electronic system including the same" was invented by Myunghun Woo (Hwaseong-si, South Korea), Jooheon Kang (Seoul, South Korea), Hyunmog Park (Seoul, South Korea), Jongho Woo (Hwaseong-si, South Korea), Suseong Noh (Suwon-si, South Korea) and Youngji Noh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a gate stack structure including alternately stacked insulating patterns and conductive patterns; a memory channel struct...