US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Method of manufacturing semiconductor package, semiconductor package, and imaging apparatus" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,899, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Method of manufacturing semiconductor package, semiconductor package, and imaging apparatus" was invented by Wenjun Wang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package and a method of manufacturing the same, and an imaging apparatus are provided. The method includes preparing a substrate having a first connection region and a sensor chip having a second connection region. A first bonding layer including multi-layer nano low-melting-point metal materials with different melting point gradients is provided on ...