ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,135, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Integrated circuit device" was invented by Sangkoo Kang (Suwon-si, South Korea), Wookyung You (Suwon-si, South Korea), Minjae Kang (Suwon-si, South Korea), Koungmin Ryu (Suwon-si, South Korea), Hoonseok Seo (Suwon-si, South Korea), Woojin Lee (Suwon-si, South Korea) and Junchae Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) device includes a substrate, a pair of fin-type active regions protruding from the substrate to define a trench region on the substrate, the fin-type active regions extending in a...