ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,895, issued on Aug. 18, was assigned to Samsung Electronics Co Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package and method for manufacturing the same" was invented by Jihyun Lee (Suwon-si, South Korea) and Junho Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure may include an insulation layer surrounding side surfaces of vias, connection pads on the vias, respectively, a first insulation member on the insulation layer and including through openings in which the connection pads respectively are disposed, and a second insulation member on the insulation layer and surrounding the first insulation...