ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,912, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Sunggu Kang (Suwon-si, South Korea), Jae Choon Kim (Suwon-si, South Korea), Sung-Ho Mun (Suwon-si, South Korea) and Hwanjoo Park (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution layer structure, a semiconductor structure on the redistribution layer structure, at least one heat dissipation structure on the semiconductor structure, where the at least one heat dissipation structure may include a first epoxy molding compound, a molding material for mol...