US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor device including interconnect structure with metal jump structure connecting adjacent metal lines" (New York, Virginia Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,892, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (South Korea).

"Semiconductor device including interconnect structure with metal jump structure connecting adjacent metal lines" was invented by Jaemyung Choi (Niskayuna, N.Y.), Johnsoo Kim (Clifton Park, N.Y.), Joongsuk Oh (Watervliet, N.Y.) and Kang-Ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device which includes: a base layer; a 1st metal line extended in a 1st direction on the base layer; a 2nd metal line extended in the 1st direction, and adjacent to the 1st metal line at a same level, on the base layer; and a metal jum...