US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Cover wafer and method of cleaning substrate processing apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,712,164, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Cover wafer and method of cleaning substrate processing apparatus including the same" was invented by Doyoung Kim (Suwon-si, South Korea), Seungkyu Lim (Suwon-si, South Korea), Nohsung Kwak (Suwon-si, South Korea), Minkyu Park (Suwon-si, South Korea), Daegyu Lim (Suwon-si, South Korea), Eunkyeom Kim (Suwon-si, South Korea), Hyeonggyu Kim (Suwon-si, South Korea), Taemin Park (Suwon-si, South Korea), Wonbo Shim (Suwon-si, South Korea), Sungjun Ann (Suwon-si, South Korea) and Jinwoo Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A ...