US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,044, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Soldering device including pulsed light irradiator, soldering method using pulsed light irradiation, and method of manufacturing semiconductor package" was invented by Sinyeop Lee (Suwon-si, South Korea), Taegyu Kang (Suwon-si, South Korea) and Jaeseon Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A soldering device includes a control unit to predict a final rise temperature of an electronic device, based on power of a light pulse from at least one pulsed light irradiator, a weight of the electronic device, a real-time temp...