ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,009, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package with organic interposer" was invented by Myung Sam Kang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an organic interposer on the package substrate, the organic interposer including a plurality of organic insulating layers including an organic compound, at least two semiconductor chips on the organic interposer, and a mold, on an upper surface of the organic interposer, surrounding the at least two semiconductor chips."
The patent was filed on April 26, 20...