US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor package having a first package structure including a first redistribution structure and a second package structure including a second redistribution structure" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,041, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package having a first package structure including a first redistribution structure and a second package structure including a second redistribution structure" was invented by Mina Choi (Suwon-si, South Korea) and Heejung Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A first package structure including a first redistribution structure, at least one first semiconductor chip disposed on the first redistribution structure, a first encapsulant covering the at least one first semiconductor chip, and a first through-vi...