US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Semiconductor memory device including pad sacrifice films and electronic system including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,951, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor memory device including pad sacrifice films and electronic system including the same" was invented by Ji Youn Seo (Suwon-si, South Korea), Sang Ho Rha (Suwon-si, South Korea) and Tae-Jong Han (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor memory device includes a peripheral circuit structure including a peripheral circuit substrate, a peripheral circuit element on the peripheral circuit substrate, and a wiring structure connected to the peripheral circuit element and a memory cell structure provided on t...