ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,708,002, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor device" was invented by Yoonyoung Jeon (Suwon-si, South Korea), Youngmin Kim (Suwon-si, South Korea), Joonseok Oh (Suwon-si, South Korea), Woongkeon Lee (Suwon-si, South Korea) and Changbo Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first redistribution structure having at least one first redistribution layer and at least one first insulating layer that are alternately stacked, a semiconductor chip electrically connected to the first redistribution structure, a second insulating...