US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Printed circuit board and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,569, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board and semiconductor package including the same" was invented by Jin Duck Park (Suwon-si, South Korea), Chan-Sik Kwon (Suwon-si, South Korea), Yong-Seong Kim (Suwon-si, South Korea) and In Wook Im (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes: a substrate body part including a first region and a second region, and including a first side and a second side; first upper redistribution patterns disposed on the first side in the first region; third upper redistribution patterns disposed...