US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Integrated circuit device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,633, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Integrated circuit device and method of manufacturing the same" was invented by Dongwon Lim (Suwon-si, South Korea), Inseok Baek (Suwon-si, South Korea), Sangbin Ahn (Suwon-si, South Korea), Seokyeong Choi (Suwon-si, South Korea) and Seungyong Hong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device including a first cell block on a substrate that includes a first cell area, a first dummy cell area surrounding the first cell area in a plan view, the first dummy cell area including first active regions and s...