US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Electronic device comprising printed circuit board structure accommodating thermal interface material" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,601, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Electronic device comprising printed circuit board structure accommodating thermal interface material" was invented by Bongkyu Min (Suwon-si, South Korea), Taewoo Kim (Suwon-si, South Korea), Jinyong Park (Suwon-si, South Korea), Hyelim Yun (Suwon-si, South Korea), Hyeongju Lee (Suwon-si, South Korea) and Jiseon Han (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a base plate, a first component disposed on the base plate, a second component which is disposed on the base ...