US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor package including test pattern and method of fabricating the same" (South Korean Inventor)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,961, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including test pattern and method of fabricating the same" was invented by Youngbae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package, including a first semiconductor chip, and a second semiconductor chip on the first semiconductor chip, wherein the first semiconductor chip includes a test pattern, and wherein a frequency based on stress being exerted on the first semiconductor chip is measured based on the test pattern."

The patent was filed on July 19, 2023, under Applicat...