US Patent Issued to SAMSUNG ELECTRONICS on April 7 for "Semiconductor device including dummy pad" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,758, issued on April 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device including dummy pad" was invented by Inhyo Hwang (Suwon-si, South Korea), Young Lyong Kim (Suwon-si, South Korea) and Hyunsoo Chung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include a first substrate including device and edge regions, a first insulating structure on the first substrate, first metal pads and first dummy pads at the uppermost end of the first insulating structure, a second insulating structure on the first insulating structure, second metal pads and second dummy pads...