US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Temperature margin setting method for 3D integrated circuit" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,608,526, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Temperature margin setting method for 3D integrated circuit" was invented by Ki-Ok Kim (Suwon-si, South Korea), Jingon Lee (Suwon-si, South Korea) and Mijeong Lim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of designing a 3D integrated circuit includes generating a distance-delay table with respect to at least one of a first chip or a second chip stacked on the first chip, based on a thermal analysis result, calculating a first timing path distance with respect to a first timing path corresponding to the first chip in a...