US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "System-on-chip and an interconnect bus included in the system on chip" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,608,327, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"System-on-chip and an interconnect bus included in the system on chip" was invented by Byungtak Lee (Jeju-si, South Korea), Hee-Seong Lee (Siheung-si, South Korea) and Myungkyoon Yim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A system-on-chip including: a first slave having a first safety level; a second slave having a second safety level; a first master having a third safety level, the first master outputs a first access request for the first slave and a second access request for the second slave; a safety function protection con...