US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Substrate processing system and method of manufacturing semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,908, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing system and method of manufacturing semiconductor device using the same" was invented by Songyi Baek (Hwaseong-si, South Korea), Youngtack Sim (Hwaseong-si, South Korea), Jiwon Kwak (Suwon-si, South Korea), Sejin Kyung (Seoul, South Korea), Daewee Kong (Yongin-si, South Korea) and Taemin Kim (Seongnam-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing system includes: a process chamber that performs a semiconductor process on a substrate; a first oxygen supply unit; a first chamber that receives a ga...