US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Substrate processing apparatus, substrate processing method and method of fabricating semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,772, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate processing apparatus, substrate processing method and method of fabricating semiconductor device" was invented by Woo Rim Lee (Suwon-si, South Korea), Myoung Jae Seo (Suwon-si, South Korea), Sung Gil Kang (Suwon-si, South Korea), Hyun Ho Doh (Suwon-si, South Korea), Sung Yong Park (Suwon-si, South Korea) and In Hye Jeong (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of fabricating a semiconductor device is provided. The method includes: loading a substrate into a substrate processing apparatus; and processing th...