ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,749, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Solder reflow system and solder reflow method using the same" was invented by Youngja Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A solder reflow system may include a solder reflow apparatus, a condensation apparatus and a cleaning apparatus. The solder reflow apparatus may be configured to reflow a solder of a semiconductor package using a heat transfer fluid. The condensation apparatus may be configured to receive the semiconductor package processed by the solder reflow apparatus. The condensation apparatus may condensate ...