ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,850, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package and method for manufacturing the same" was invented by Sung Gu Kang (Suwon-si, South Korea), Jae Choon Kim (Suwon-si, South Korea), Hwan Joo Park (Suwon-si, South Korea) and Sung-Ho Mun (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package with improved thermal properties is provided. The semiconductor package includes a first package including a first die, an interposer on the first package and including a first area and a second area. A second package is on a top face of the interposer in th...