ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,560, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor package" was invented by Joonsung Kim (Suwon-si, South Korea), Jihwang Kim (Suwon-si, South Korea), Jeongho Lee (Suwon-si, South Korea), Dongwook Kim (Suwon-si, South Korea), Wonkyoung Choi (Suwon-si, South Korea) and Yunseok Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a lower package, an upper package on the lower package, and an inter-package connector between the lower package and the upper package. The lower package includes a first redistribution structure, a first semicon...