US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor device and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,865, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and semiconductor package" was invented by Jaekyung Yoo (Seoul, South Korea), Jinwoo Park (Seoul, South Korea), Jayeon Lee (Seongnam-si, South Korea) and Jaeeun Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a plurality of semiconductor chips sequentially stacked on a substrate, an underfill layer between the plurality of semiconductor chips and between the substrate and a lowermost one of the plurality of semiconductor chips, and a molding resin extending around the plura...