US Patent Issued to SAMSUNG ELECTRONICS on April 21 for "Semiconductor device and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,574, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device and method for manufacturing the same" was invented by Kyung Bin Chun (Suwon-si, South Korea), Jin Bum Kim (Suwon-si, South Korea), Dong Suk Shin (Suwon-si, South Korea), Gyeom Kim (Suwon-si, South Korea) and Da Hye Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower pattern on a substrate and protruding in a first direction, a source/drain pattern on the lower pattern and including a semiconductor liner film in contact with the lower pattern, and an epitaxial insulating l...