ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,860, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Multi-chip stacking method" was invented by Yeunhee Huh (Namyangju-si, South Korea) and Chisung Bae (Yongin-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit having a plurality of stacked chips, and a method of manufacturing thereof are provided. The integrated circuit includes a substrate, a plurality of chips stacked on a printed circuit board, wherein each of the plurality of chips includes a plurality of circuits, and a plurality of interconnects configured to electrically connect each of the plurality of circuits i...