ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,449, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Electronic device including thermal interface material" was invented by Wanjae Ju (Suwon-si, South Korea), Kiyeong Jeong (Suwon-si, South Korea) and Nurimaka Jung (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a printed circuit board including a through hole, an electronic component disposed on the printed circuit board, a shield can covering the electronic component, and a thermal interface material (TIM) included in a space between the printed circuit board and the ...