US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Substrate polishing apparatus and method of polishing substrate using the same" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,600,008, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate polishing apparatus and method of polishing substrate using the same" was invented by Donghoon Kwon (Suwon-si, South Korea) and Boun Yoon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate polishing apparatus includes a polishing pad including a magnetic material, a platen having an upper surface to which the polishing pad is attached, a slurry supply unit installed on the polishing pad, a conditioner installed on the polishing pad to be spaced apart from the slurry supply unit in the one direction and configured ...