US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,779, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Seokhyun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a lower redistribution wiring layer having: a first chip mounting region; a peripheral region, and lower redistribution wirings; a logic semiconductor chip mounted in the first chip mounting region, the logic semiconductor chip having a plurality of first through electrodes that are electrically connected to at least some of the lower redistributio...