ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,757, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-Si, South Korea).
"Semiconductor package" was invented by Bo In Noh (Suwon-si, South Korea), Jeong Hoon Ahn (Suwon-si, South Korea) and Yun Ki Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a circuit board, an interposer structure on the circuit board, a first semiconductor chip and a second semiconductor chip on the interposer structure, the first and the second semiconductor chips electrically connected to the interposer structure and spaced apart from each other, and a mold layer between the first and second s...