ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).
"Semiconductor package" was invented by Hyeonjun Song (Hwaseong-si, South Korea), Taehyeong Kim (Suwon-si, South Korea) and Sangyoung Kim (Cheonan-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base chip including a passivation layer on an upper surface thereof, a semiconductor chip on the base chip, a bump on a lower surface of the semiconductor chip, an underfill layer covering the bump and covering the lower surface of the semiconductor chip, an encapsulant covering the semiconductor chip on the bas...