ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,459, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Semiconductor device and method for fabricating the same" was invented by Seong Min Choo (Seoul, South Korea), Hyuk Woo Kwon (Seoul, South Korea), Dong Woo Kim (Hwaseong-si, South Korea) and Byoung Deog Choi (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device including a first pad on a substrate extending in a first direction and a second direction, a lower electrode connected to and disposed on the first pad, first to third supporter layers disposed on a side wall of the lower electrode and sequentially spaced ap...