US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor chip and semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,775, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor chip and semiconductor package" was invented by Hyeonmin Lee (Suwon-si, South Korea), Jihoon Kim (Suwon-si, South Korea) and Aenee Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first substrate, a plurality of first pads disposed on a front surface of the first substrate, a first insulating layer surrounding the plurality of first pads, and a plurality of wiring patterns disposed between the first substrate and the plurality of first pads and...