ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,482, issued on July 21, was assigned to Samsung Electronics Co. Ltd (Suwon-si, South Korea) and SEMES Co. LTD. (Cheonan-si, South Korea).
"Substrate bonding apparatus" was invented by In Hwa Baek (Suwon-si, South Korea), Se Hyun Lee (Cheonan-si, South Korea), Su Chul Park (Cheonan-si, South Korea), Kyung Su Yoon (Cheonan-si, South Korea), Young Ho Kim (Suwon-si, South Korea) and Ho Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate bonding apparatus of the present disclosure includes a first chuck having a diameter larger than that of a first substrate; a deformation plate configured to support the first substrate,...