US Patent Issued to SAMSUNG ELECTRONICS, Research & Business Foundation Sungkyunkwan University on Sept. 1 for "Semiconductor device comprising two-dimensional material and method of manufacturing the semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,220, issued on Sept. 1, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea) and Research & Business Foundation Sungkyunkwan University (Gyeonggi-do, South Korea).

"Semiconductor device comprising two-dimensional material and method of manufacturing the semiconductor device" was invented by Junyoung Kwon (Suwon-si, South Korea), Sangwoo Kim (Yongin-si, South Korea), Kyung-Eun Byun (Suwon-si, South Korea), Minsu Seol (Suwon-si, South Korea), Minseok Shin (Suwon-si, South Korea), Pin Zhao (Suwon-si, South Korea), Taehyeong Kim (Suwon-si, South Korea) and Jaehwan Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Offic...