US Patent Issued to SAMSUNG ELECTRONICS, POSTECH Research and Business Development Foundation on April 21 for "Electronic device including a semiconductor element on a glass substrate, where the semiconductor element is connected to a feed line by a second pattern and a via hole" (South Korean Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,609,433, issued on April 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and POSTECH Research and Business Development Foundation (Pohang-si, South Korea).

"Electronic device including a semiconductor element on a glass substrate, where the semiconductor element is connected to a feed line by a second pattern and a via hole" was invented by Seungtae Ko (Suwon-si, South Korea), Youngju Lee (Suwon-si, South Korea), Jaehong Choi (Pohang-si, South Korea) and Wonbin Hong (Pohang-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device includes: a glass substrate including a first surface and a second surfa...