US Patent Issued to SAMSUNG ELECTRONICS, INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION on July 28 for "Organometallic compound comprising a metal combined with at least one ligand containing four or more fluorine atoms, resist composition comprising the same, and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,693,595, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea) and INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION (Incheon, South Korea).

"Organometallic compound comprising a metal combined with at least one ligand containing four or more fluorine atoms, resist composition comprising the same, and method of fabricating semiconductor device using the same" was invented by Jin-Kyun Lee (Suwon-si, South Korea), Chawon Koh (Suwon-si, South Korea), Ye-Jin Ku (Suwon-si, South Korea), Tsunehiro Nishi (Suwon-si, South Korea), Hyunwoo Kim (Suwon-si, South Korea) and Hyung-Ju Ahn (Suwon-si, South Korea).

According to the abstract* released by the U.S. Paten...