ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,094, issued on Sept. 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Printed circuit board" was invented by Seung Min Lee (Suwon-si, South Korea), Francis Saynes (Suwon-si, South Korea) and Keun Woo Kwon (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second ...