ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,665, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Substrate and method of manufacturing the same" was invented by Chanhoon Ko (Suwon-si, South Korea), Chulmin Lee (Suwon-si, South Korea), Inhwan Oh (Suwon-si, South Korea), Kyounghee Lim (Suwon-si, South Korea), Sohyun Bae (Suwon-si, South Korea) and Sanghoon Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate includes: a first insulating layer; a second insulating layer disposed on the first insulating layer; and a via hole including a lower hole formed in the first insulating layer, and an upper hole formed in th...