US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 22 for "Multilayer electronic component including side margin portions and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,744,162, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component including side margin portions and method of manufacturing the same" was invented by Yong Park (Suwon-si, South Korea), Min Woo Kim (Suwon-si, South Korea), Jong Ho Lee (Suwon-si, South Korea), Eun Jung Lee (Suwon-si, South Korea), Yong Min Hong (Suwon-si, South Korea), Yong Ung Lee (Suwon-si, South Korea) and Jung Tae Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an example embodiment of the present disclosure, an average distance in the first direction from the active-cover boundary ...