ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,744,156, issued on Sept. 22, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).
"Multilayer electronic component" was invented by Jung Wun Hwang (Suwon-si, South Korea), Chae Dong Lee (Suwon-si, South Korea), Sun Kyoung Park (Suwon-si, South Korea) and Ji Hye Oh (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer electronic component includes a body including a dielectric layer and first to fourth internal electrode layers disposed alternately in a first direction with the dielectric layer interposed therebetween; and first and second external electrodes disposed on the third and fourth surfaces r...