ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,975, issued on Sept. 15, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board" was invented by Jae Heun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a printed circuit board including: a glass layer; a first wiring layer disposed on an upper surface of the glass layer; and a capacitor including a plurality of blind holes penetrating through a portion of the glass layer from an upper surface to a lower surface of the glass layer, respectively, a first electrode layer disposed on the upper surface of the glass layer and extending into each of t...