US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Oct. 20 for "Multilayer electronic component and manufacturing method thereof" (South Korean Inventor)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,770,793, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea).

"Multilayer electronic component and manufacturing method thereof" was invented by Yang-Seok Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a multilayer electronic component according to an aspect or another aspect of the present disclosure, a protective layer including a plurality of oxides having a wired form is disposed on at least a portion of an external surface of a body. Alternatively or optionally, the protective layer including an oxide having a wired form is disposed on at least a portion of a space between the...